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TTC Fix: AI-Based Solution for Inspection

In the current world of allocation, it goes without saying that electronics manufacturers are doing everything they possibly can to fully maximize every single resource on the factory floor. While minimizing waste was a top concern pre-COVID supply chain disruptions, today the most successful manufacturers have taken a zero-tolerance approach to waste.

Searching for novel ways to optimize the manufacturing process and get the most out of what they have, many electronics manufacturers are zeroing in on the repair process – as there tends to be a lot of waste here due to its manually intensive nature with components and boards at risk of being damaged or even scrapped. The best way to reduce PCBAs getting sent to repair, or wasting too much time physically getting repaired, is to check units sooner in the assembly process with a pre-soldering inspection solution.

And while there are many of these on the market, the newest release of Cogiscan’s TTC Fix differentiates itself from the noise with two major differentiators:

• The 2D inspection machine is based on an AI and machine-learning platform that uses a neural network to detect and identify the most common placement errors
• Thorough integration with a visual repair tool that seamlessly and intuitively guides the repair with detailed defect images and full traceability reporting

When integrating a new machine to the manufacturing process, it’s paramount that it doesn’t add unnecessary time (waste) to the overall assembly. In many cases, a standard pre-solder inspection machine adds too much time to the process because programming it requires engineering time and resources that are already stretched to the max.

TTC Fix solves that problem by using a machine-learning neural network to perform programming – a new PCBA can be programmed in less than 5 minutes. Typically, programming can take longer than 45 minutes and requires intensive operator input overtime to be fully optimized. This intelligent learning platform guarantees continuous and automatic learning thanks to the cloud-based AI algorithms.

Instead of waiting for the defect to be caught at a post solder operation, whether that’s after reflow or hand soldering, TTC Fix captures 85% of SMD and THT placement errors, including missing, upside-down, skewed, and wrong polarity. Flag and correct the defect before it gets harder, or even impossible, to fix.

From a smart factory perspective, it doesn’t make an ounce of sense to add a process that can’t be fully integrated – if the captured defect images are only stored and accessed on the machine itself, it’s not truly useful to improving the entire defect management process. TTC Fix addresses this head-on by coming fully integrated with Cogiscan’s Co-NECT platform and TTC Server for centralized access, storage, management, and sharing of all found defects. The web-based visual repair tool also included in TTC Fix provides intuitive instructions to guide the repair process and includes all the traceability details, with images, of the flagged defect.